SMEC GB Series β Grinding Turning Centers
| Specification | PL 800GB | SL 1000GB |
|---|---|---|
| Travels (X/Z) mm(inch) | 400/400(15.75/15.75) | 510/500(20.08/19.69) |
| Max turning dia mm(inch) | 650(25.60) | 820(32.29) |
| Max turning length mm(inch) | 150(5.91) | 340(13.39) |
| Spindle speed rpm | 2,200 | 1,000 |
| Main motor kW(Hp) | 11/15(14.76/20.12) | 7.5/11(10.06/14.76) |
| Spindle nose ASA | A2-6 | A2-6 |
| Rapid traverse (X/Z) m/min(ipm) | 24/30(944.89/1,181.11) | 16/16(629.93/629.93) |
| Spindle lubrication and cooling | Grease lubrication, natural cooling | Grease lubrication, natural cooling |
GB Series
PL 800GB / SL 1000GB
High precision, high rigidity ceramic and quartz grinding machine
– Superb stability with the use of precision bearings
– High position accuracy and extended machine lifetime
– High rigidity bed and spindle design for minimized thermal growth
– Optimized to machine ceramic, SiC and quartz needed to manufacture semiconductor wafers
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